HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
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  • HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
  • HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
  • HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
  • HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
  • HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
  • HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version
  • HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version

HSD 4+2-Pin Vertical Through-Hole Reflow Solder Header, APH Version


Application Scenario Due to the upgrading of vehicle systems, Ethernet, 5G communication, RF technology, millimeter wave, LIDAR and other new technologies in a large number of applications, coupled with new energy high-voltage, high-current to join the deterioration of the EMC so that the wire harness shielding requirements are higher, the HSD high-speed data lines will be used in a large number of future vehicles, so that the traditional wiring harness equipment from the type of the future can not meet the requirements of the new technological changes.HSD is applied to Advanced Driver Assistance Systems (ADAS), Telematics, Multimedia, Infotainment, GPS, Navigation and Cameras, Body Control, Safety, Security and Comfort

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Aohua
Aohua Intelligence

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